isotropic etchant

isotropic etchant
izotropinis ėsdiklis statusas T sritis radioelektronika atitikmenys: angl. isotropic etchant vok. isotroper Ätzer, m rus. изотропный травитель, m pranc. décapant isotrope, m

Radioelektronikos terminų žodynas. – Vilnius : BĮ UAB „Litimo“. . 2000.

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  • Isotropic etching — In semiconductor technology isotropic etching is non directional removal of material from a substrate via a chemical process using an etchant substance. The etchant may be a corrosive liquid or a chemically active ionized gas, known as a… …   Wikipedia

  • décapant isotrope — izotropinis ėsdiklis statusas T sritis radioelektronika atitikmenys: angl. isotropic etchant vok. isotroper Ätzer, m rus. изотропный травитель, m pranc. décapant isotrope, m …   Radioelektronikos terminų žodynas

  • isotroper Ätzer — izotropinis ėsdiklis statusas T sritis radioelektronika atitikmenys: angl. isotropic etchant vok. isotroper Ätzer, m rus. изотропный травитель, m pranc. décapant isotrope, m …   Radioelektronikos terminų žodynas

  • izotropinis ėsdiklis — statusas T sritis radioelektronika atitikmenys: angl. isotropic etchant vok. isotroper Ätzer, m rus. изотропный травитель, m pranc. décapant isotrope, m …   Radioelektronikos terminų žodynas

  • изотропный травитель — izotropinis ėsdiklis statusas T sritis radioelektronika atitikmenys: angl. isotropic etchant vok. isotroper Ätzer, m rus. изотропный травитель, m pranc. décapant isotrope, m …   Radioelektronikos terminų žodynas

  • Etching (microfabrication) — Etching tanks used to perform Piranha, Hydrofluoric acid or RCA clean on 4 inch wafer batches at LAAS technological facility in Toulouse, France Etching is used in microfabrication to chemically remove layers from the surface of a wafer during… …   Wikipedia

  • Microelectromechanical systems — (MEMS) (also written as micro electro mechanical, MicroElectroMechanical or microelectronic and microelectromechanical systems) is the technology of very small mechanical devices driven by electricity; it merges at the nano scale into… …   Wikipedia

  • Deep reactive-ion etching — (DRIE) is a highly anisotropic etch process used to create deep penetration, steep sided holes and trenches in wafers, with aspect ratios of 20:1 or more. It was developed for microelectromechanical systems (MEMS), which require these features,… …   Wikipedia

  • Stiction — is an informal portmanteau of the term static friction ( μ s), perhaps also influenced by the verb stick .Two solid objects pressing against each other (but not sliding) will require some threshold of force parallel to the surface of contact in… …   Wikipedia

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